Toshiba America Electronic Components, Inc. (TAEC)*, a committed industry leader that collaborates with customers to create breakthrough designs, will exhibit next-generation displays and technologies developed by Toshiba Mobile Display Co., Ltd. (TMD)** for mobile phones and portable electronics, automotive applications, industrial markets and 3D applications in booth #1119 at the 2011 Society for Information Display (SID) International Symposium, Seminar& Exhibition, May 17 to 19, 2011.
Featured developments in TAEC's booth this year include two different 3D technology demonstrations, new displays for high-resolution handheld mobile applications, high-resolution and high-reliability automotive displays and industrial LCD displays with replaceable LED backlights capable of 100,000 hours MTBF1. Displays with Low Temperature Poly-Silicon (LTPS), Optically Compensated Bend (OCB), System-on-Glass (SOG), LED backlighting, and other advanced technologies can be viewed in five demonstration areas: mobile, automotive, industrial, 3D, and SOG in-cell technology.
"We are excited to exhibit several new and innovative products and technologies aimed at mobile, automotive and industrial applications. Our advancements in system-on-glass in-cell technology and our approaches to 3D will enable future growth in new markets and applications," said Clayton Bond, senior vice president, Display Devices and Components Business Unit for TAEC.
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