Toshiba America Electronic Components To Showcase 3D And Other Innovative LCD Technologies At SID 2011

Toshiba America Electronic Components, Inc. (TAEC)*, a committed industry leader that collaborates with customers to create breakthrough designs, will exhibit next-generation displays and technologies developed by Toshiba Mobile Display Co., Ltd. (TMD)** for mobile phones and portable electronics, automotive applications, industrial markets and 3D applications in booth #1119 at the 2011 Society for Information Display (SID) International Symposium, Seminar& Exhibition, May 17 to 19, 2011.

 Featured developments in TAEC's booth this year include two different 3D technology demonstrations, new displays for high-resolution handheld mobile applications, high-resolution and high-reliability automotive displays and industrial LCD displays with replaceable LED backlights capable of 100,000 hours MTBF¹. Displays with Low Temperature Poly-Silicon (LTPS), Optically Compensated Bend (OCB), System-on-Glass (SOG), LED backlighting, and other advanced technologies can be viewed in five demonstration areas: mobile, automotive, industrial, 3D, and SOG in-cell technology.

"We are excited to exhibit several new and innovative products and technologies aimed at mobile, automotive and industrial applications. Our advancements in system-on-glass in-cell technology and our approaches to 3D will enable future growth in new markets and applications," said Clayton Bond, senior vice president, Display Devices and Components Business Unit for TAEC.

Source

Toshiba Mobile Display Company And Toshiba Corporation To Present Technical Papers At SID 2011

Toshiba America Electronic Components, Inc. (TAEC),* announced that Toshiba Mobile Display Co., Ltd. (TMD)** and Toshiba Corporation R&D representatives will present seven papers addressing next-generation display technologies at the Society for Information Display (SID) Symposium, Seminar and Exhibition at the Los Angeles Convention Center in Los Angeles, California this week.

The presentation schedule for TMD and Toshiba technical papers is as follows:

Presentation 4.1:“Low-Temperature-Processed IGZO TFTs for Flexible AMOLED Displays with Integrated Gate Driver Circuits”

Session 4:Oxide TFTs I

Time and Location:Tuesday (5/17), 10:50am– 11:10am, Petree Hall C

Presenter:Toshiba Corp., Kawasaki, Japan

Synopsis:The threshold-voltage shift of 200ºC IGZO TFTs to 0.3 V (at Vg = 20 V, 90ºC, 2000 sec) was reduced by optimizing the IGZO deposition conditions. A flexible AMOLED display with integrated gate driver circuits has been demonstrated.

Presentation 19.4:“Novel Depth-Perception-Controllable Method of WARP under Real Space Conditions”

Session 19:Large-Area, Head-Up, and Rugged Display Applications

Time and Location:Tuesday (5/17), 4:40pm– 5:00pm, Room 408A

Presenter:Toshiba Corp., Kawasaki, Japan

Synopsis:A compact 2-liter monocular head-up display that is WARP-mountable on an automobile windshield has been developed. A novel depth-perception-controllable method is proposed and the depth-perception-enhancement characteristics under real-space conditions have been examined. It was confirmed that the depth perception was controlled as far as 60 m and true AR was achieved.

Presentation 43.4:“An In-Cell Capacitive Touch-Sensor Integrated in an LTPS WSVGA TFT-LCD”

Session 43:Capacitive Touch Systems

Time and Location:Thursday (5/19), 10:00am– 10:20am, Petree Hall D

Presenter:Toshiba Mobile Display Co., Ltd., Saitama, Japan

Synopsis:An in-cell capacitive touch-sensor integrated in an LTPS 7” WSVGA TFT-LCD. The prototype having 256x150 sensors shows advantages such as high position accuracy, multi-touch (10 or more), smooth operation with no touch force, thin and light LCD module, and thus is suitable for various applications.

Presentation 50.3:“Novel Write-Erasable Input Display with Memory Circuits and Photosensors”

Session 50:Optical Touch Systems

Time and Location:Thursday (5/19), 11:20am– 11:40am, Petree Hall D

Presenter:Toshiba Mobile Display Co., Ltd., Ishikawa, Japan

Synopsis:We have developed a new conceptual LCD with a memory circuit and a photo-sensor in each pixel. This LCD display enables a still image in a low power mode. In addition, by using a light-pen direct writing and erasing of a character on the LCD is possible without calculating coordinates.

Presentation 53.3:“New Light-Bar Emitting Phosphor-Converted White Line Light Pumped by InGaN/GaN Laser Diode for Edge-Lit Backlight-Unit Applications”

Session 53:LED and Laser Backlights

Time and Location:Thursday (5/19), 11:20am– 11:40am, Room 408A

Presenter:Harison Toshiba Lighting Corp., Ehime, Japan

Synopsis:A light bar for an edge-lit BLU pumped by novel InGaN/GaN laser diodes (LDs) at a wavelength around 400 nm has been demonstrated. Compared to an LED light bar, the LD light bar shows high thermal stability with a center luminance change of only 6.7%, and a chromaticity change (Dx, Dy) of (-0.001, +0.002).

Presentation 55.4:“Image-Processing-Based Cross-Talk Reduction for Stereoscopic Displays with Shutter Glasses”

Session 55:Crosstalk in Stereoscopic Displays

Time and Location:Thursday (5/19), 2:30pm– 2:50pm, Concourse Hall

Presenter:Toshiba Corp., Kawasaki, Japan

Synopsis:A crosstalk reduction method based on image processing for stereoscopic displays with shutter glasses is proposed. The proposed method precisely evaluates crosstalk caused by not only LCD responses but also backlight leakage and the response of the glasses. Experimental results show that the method reduces crosstalk by 70 percent.

Poster Session P.57:“Local-Dimming Algorithm to Minimize Maximum Luminance Reproductive Error”

Session 55:Display Electronics Posters

Presenter:Toshiba Corp., Kanagawa, Japan

Synopsis:A local-dimming algorithm that guarantees both low power consumption and higher reproducibility, even at lower luminance levels, will be described. A new objective function is defined to evaluate reproducibility both at higher and lower luminance.

Source

Toshiba Introduces New High Luminous Flux White LEDs

Toshiba America Electronic Components, Inc.,(TAEC)* has announced the addition of a new series of LEDs. Using a new package design, TAEC has developed small high luminous flux white LEDs with high luminous efficiency. With a broad lineup ranging from high-efficient, high-output models to high-color rendering models, these LEDs can be used as light sources for a variety of lighting applications, including replacement lamps, architectural lighting, retail display, commercial/industrial, outdoor and residential lighting.

Ideal as a replacement for traditional fluorescent bulbs in general lighting applications, Toshiba's new high-output white LEDs provide one of the industry's highest level of efficiency at 120 lm/W, are housed in a very thin package (0.65 mm thick, making them suitable for small equipment) and have a long lifespan due to low thermal resistance. Additionally, a unique packaging structure and wide directional characteristics make these LEDs appropriate for lighting large areas.

Source

Toshiba Debuts SmartNAND, Latest Addition to NAND Flash Portfolio

Toshiba America Electronic Components, Inc. (TAEC)*today announced that it has enhanced its NAND flash portfolio with the introduction of SmartNAND

Source

Toshiba Adds Ultra-Small Package 200

Toshiba America Electronic Components, Inc.,(TAEC)* has announced the addition of theTCR4SxxWBGand TC4SxxDWBG series to its family of 200mA CMOS Low Drop-Out regulators (LDOs). Developed by Toshiba Corp., the new single-output LDO regulators feature an ultra-small WCSP4 package which measures 0.79mmx0.79mmx0.50mm and only requires a 0.63 mm²mounting area. The TCR4SxxWBGand TCR4SxxDWBG series are ideal for applications that require high-density packaging, such as mobile phones, portable audio players and a range of mobile equipment. Toshiba also offers single-output LDO regulators in SMV, (SOT-25) , UFV, and ESV (SOT-553) packages.

An increasing number of low voltage applications require the use of LDOs, as these regulators provide a stable power supply voltage independent of load impedance, and input-voltage variations. Toshiba's TCR4SxxWBG LDOand TCR4SxxDWBGregulators feature an output voltage range from 1.2V and 3.6V in increments of 50mV. The maximum output current is 200mA and over-current protection functionality is built-in. In addition, Toshiba's TCR4SxxDWBG LDO regulators provide built-in auto-discharge and control pull-downresistor functions.

Source

SD Memory Cards And Solid State Drives From Toshiba Enable Solid Performance For Consumer Electronics

Toshiba America Electronic Components, Inc. (TAEC)*will be on hand at International CES 2011 to demonstrate the company's latest SD memory cards and SATA solid state drive (SSD) offerings. Both families of products will be showcased at International CES 2011 in booth #11026 from January 6-9.

As the inventor of NAND Flash, Toshiba is advancing technology to enable the ultimate consumer experience. Scott Nelson, vice president, Memory Business Unit, Toshiba America Electronic Components, Inc. explained,

Source

Toshiba Announces Restructuring of System LSI Business

Toshiba Corporation (TOKYO: 6502) today announced that it is promoting a series of measures to transform its System LSI business, with the goal of boosting profitability by allocating resources to focus product areas, and executing a thorough review of its business model to achieve fabless and fablite models. Towards this, the company will restructure its current System LSI Division on January 1, 2011.

Toward accelerating decision-making speed and optimizing use of management resources, the division will be reorganized into two: the Logic LSI Division, responsible for cutting-edge SoC (system-on-chip) fabricated on 300mm wafer fabrication lines; and the Analog and Imaging IC Division, which supplies key components for a wide range of products.

The Logic LSI Division will promote a flexible manufacturing strategy responsive to demand volatility by combining use of its own production line with outsourcing. The division will expand outsourcing of cutting-edge products, including 40nm products, to multiple foundries from fiscal year 2011. By consolidating production on 300mm wafers at Oita Operations, the division will increase management efficiency and will also be able to channel more resources to its development and design sections.

The Analog and Imaging IC Division will concentrate on analog ICs and imaging ICs, particularly CMOS image sensors, and use existing production lines at Oita Operations, including 300mm wafer lines, and Iwate Toshiba Electronics Co., Ltd. The main focus will be general-purpose products, allowing the division to streamline its production lines. This approach is expected to support business expansion and to enhance profitability.

Since the 2008 financial crisis, Toshiba’s system LSI business has promoted strategic allocation of resources under the Toshiba Group Action Programs to Improve Profitability announced in January 2009. The main focus has been on promoting analog ICs, CMOS image sensors and digital SoCs, discontinuing unprofitable products, and restructuring the back-end process through consolidation and increasing overseas production ratio.

As part of the strategy for transforming the system LSI business and securing an asset light business model, Toshiba has signed a memorandum of understanding with Sony Corporation, expressing the intent to dissolve Nagasaki Semiconductor Manufacturing Corporation (NSM) and to transfer 300mm wafer fabrication lines there from Toshiba to Sony. Promoting this measure in an area where demand is volatile, and concentrating management resources in Oita Operations, will allow Toshiba to enhance its productivity and cost structure.

Going forward, Toshiba expects the present transformation and reorganization to promote operating structures optimized to the characteristics of each part of its system LSI business, and to achieve an organization that contributes to improved profitability.

Source